Canton Semiconductor’s ChiNext IPO Accepted by the Shenzhen Stock Exchange; Expected Financing of RMB 7.5 Billion

On December 19, the ChiNext IPO filing of Canton Semiconductor Technology Co., Ltd. (hereinafter referred to as Canton Semiconductor) was accepted by the Shenzhen Stock Exchange.

Phase III Project of Canton Semiconductor

Photo by Li Jianfeng

Headquartered in Huangpu District, Canton Semiconductor is widely known as “Guangzhou’s first chip manufacturer.” It is the first locally cultivated enterprise in Guangdong Province to achieve mass production of 12-inch (300 mm) wafers, with a focus on analog chip manufacturing. Against the backdrop of the global chip shortage, Canton Semiconductor provides production capacity support exceeding 1.3 million wafers for the Guangdong-Hong Kong-Macao Greater Bay Area, serving as a key stabilizing force for an independently controllable regional industrial chain.

According to the company’s plan, the Canton Semiconductor project is being developed in three phases. Upon full completion and operation, it is expected to reach a monthly production capacity of nearly 80,000 12-inch wafers for high-end analog chip manufacturing. This capacity will meet the demand of the Greater Bay Area’s manufacturing sector for chips such as power discrete devices, power management integrated circuits, mixed-signal chips, image sensors, radio-frequency (RF) chips, and microcontrollers (MCUs).