Guangzhou's semiconductor leader fuels China's IC ambitions

Guangzhou's CanSemi Technology, a leading enterprise in Huangpu district, filed its A-share IPO application on April 25 via the CSRC system. This move marks the start of Guangdong's strategic push to become China's "third pole" in integrated circuit development.

With a registered capital of 2.37 billion yuan ($330 million), CanSemi achieved mass production in September 2019 - just 18 months after its March 2018 groundbreaking - filling regional gaps in high-end chip manufacturing. It now produces 12-inch wafers for IoT, automotive electronics, and 5G applications, with a goal of producing 80,000 wafers per month at full capacity. Recognized on the Global Unicorn Index 2022, CanSemi remains a dominant force in China's semiconductor innovation landscape.

Sino-Singapore Guangzhou Knowledge City Greater Bay Area Integrated Circuit Industrial Park. [Photo/WeChat account: guangzhougaoxinqu]

Guangzhou's semiconductor sector grew 25.8 percent in 2024, with analog chip output up 23.7 percent and wafer production surging 68.9 percent. Anchored by the "12218" industrial framework, the city has allocated 150 billion yuan in industrial funds and 50 billion yuan in venture capital to cultivate a Huangpu-centric cluster, extending to Nansha and Zengcheng.

Huangpu hosts over 150 semiconductor enterprises within its 13.2 square-kilometer Bay Area IC Park, including Shennan Circuit and Xingsen Semiconductor. Collaborations with Xidian University support microelectronics research and train 2,000 specialists triennially. National platforms like the Greater Bay Area National Technology Innovation Center strengthen Huangpu's R&D capabilities.

The district is focusing on advanced process nodes and smart sensors, pursuing technological breakthroughs to establish the Greater Bay Area as a global IC cluster.

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